Product Information

ZP07 Series

The ZP07 series reallizes high-grade processing of hard materials and compound materials by making a porous structure inside the electroplated blade.

The ZP07 series combines high cutting ability that is specific to electroplated bond blades and appropriate self sharpening ability by forming pores in the electroplated bond. It is now possible to process silicon + glass, silicon carbide (SiC) and other materials that have been difficult to cut with conventional electroplated bonds.

Features

Reallizes one-pass processing of glass + Silicon wafer
Realizes high-quality processing of silicon carbide (SiC) and other difficult-to-cut materials.
Two types available: standard and low concentration.

Applicable Workpieces

Composite materials (Glass + silicon wafer etc), SiC, Ceramics, etc.

Applicable Machines

6000 Series and 600 Series fully automatic dicing saws
3000 Series, 300 Series, and 500 Series automatic dicing saws

Specifications

All slit widths are 0.5 mm (except for the SS type)
Blade thickness greater than 0.06 mm are available

*1 Standard specification range by grit size

Experimental Data

The ZP07 series can process laminated wafers (Silicon + glass) in one pass and can achieve high-grade results on the Silicon, glass and bonded surfaces.

Reference photo (Current Electroformed Bond Blade)
With the current electroplated blade, the processing load increases and both blade and wafer break.