Product Information

ZP07 Series

The ZP07 series reallizes high-grade processing of hard materials and compound materials by making a porous structure inside the electroplated blade.

The ZP07 series combines high cutting ability that is specific to electroplated bond blades and appropriate self sharpening ability by forming pores in the electroplated bond. Processing of glass and ceramics that were difficult to process with the current electroplated bond is now possible.

Features

Reallizes one-pass processing of glass + Silicon wafer
Realizes high-grade processing of ceramics

Applicable Workpieces

Composite materials (Silicon + glass wafer etc), ceramics, etc.

Applicable Machines

6000 Series and 600 Series fully automatic dicing saws
3000 Series, 300 Series, and 500 Series automatic dicing saws

Specifications

Experimental Data

The ZP07 series can process laminated wafers (Silicon + glass) in one pass and can achieve high-grade results on the Silicon, glass and bonded surfaces.

Reference photo (Current Electroformed Bond Blade)
With the current electroplated blade, the processing load increases and both blade and wafer break.