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Product Information

NBC-Z Series

Superior cutting quality - dicing wafers to cutting substrates

The ultra-thin, high-performance NBC-Z series blades are a result of DISCO's original blade development.
These blades employ electroformed bonds that realize superb cutting quality and blade life.
In addition to dicing semiconductor wafers, these blades are suitable for dicing a wide variety of semiconductor packages.

Features

Deep cutting and grooving are possible with the super-thin up to 3" diameter blades
Blade thickness from 0.015 mm to 0.3 mm
Wide range of grit sizes and bond types are available to meet application requirements
Available for both dicers and slicers.

NBC-Z Types

The structural strength of the blades allow for ultra-thin blades to be realized.
They are suitable for dicing and deep grooving of narrow streets.

NBC-ZB Types

With improved conditioning of the lateral face of the blade, surface chipping and slant cuts are minimized. This result in improved cutting quality.

Applicable Workpieces

Silicon, GaAs, GaP, LiTaO3, etc.

Applicable Machines

6000 Series and 600 Series fully automatic dicing saws
3000 Series, 300 Series, and 500 Series automatic dicing saws

Processing Data

Application by grit size

Specifications

	*1	All slits widths are 0.5 mm (except for the SS type) Blade thickness greater than 0.04 mm are available
	*2	Blade thickness greater than 0.1 mm are available