Product Information

NBC-Z Series

Superior cutting quality - dicing wafers to cutting substrates

The ultra-thin, high-performance NBC-Z series blades are a result of DISCO's original blade development.
These blades employ electroformed bonds that realize superb cutting quality and blade life.
In addition to dicing semiconductor wafers, these blades are suitable for dicing a wide variety of semiconductor packages.

Features

Deep cutting and grooving are possible using super-thin blades.
Blade thickness - 0.015 mm to 0.3 mm
Wide range of grit sizes and bond types are available to meet application requirements
Available for both dicing saws and slicers

NBC-Z Types

The structural strength of the blade allows for ultra-thin blades to be realized. They are suitable for dicing and deep grooving of narrow streets.

NBC-ZB Types

By changing the lateral face of the blades, surface chipping and slanted cuts are minimized. This results in improved cutting quality.

Applicable Workpieces

Silicon, GaAs, GaP, LiTaO3, etc.

Applicable Machines

6000 Series and 600 Series fully automatic dicing saws
3000 Series, 300 Series, and 500 Series automatic dicing saws

Processing Data

Application by grit size

Specifications

	*1	Products that include a special specification may be denoted with "ZBT-****"
	*2	Not indicated in the case of the standard accuracy.
	*3	Standard accuracy differs depending on the product and size.
	*4	All slit widths are 0.5 mm (except for the SS type) Blade thickness greater than 0.04 mm are available
	*5	Blade thickness greater than 0.1 mm are available