Product Information

The NBC-ZH series provides high productivity and excellent process results thanks to its superb cutting ability and long life.

	The NBC-ZH series is produced using DISCO's original technology. A combination of an ultra-thin diamond blade and an aluminum hub provides enhanced operation efficiency and stable cutting results. In combination with DISCO's vast application knowledge, these blades provide excellent cutting results when dicing silicon wafers and compound semiconductor wafers such as GaAs.
	Hub blade handling safety sheet

Features

Advanced dicing process - bevel and step cutting
Wide range of grit sizes and bond types to support various application requirements
Easy to handling ultra-thin blades
Shorter blade change time - increased productivity
Environment-friendly PP (Polypropylene) packaging

Applicable Workpieces

Silicon, GaAS, GaP, LiTaO3, etc.

Applicable Machines

6000 Series and 600 Series fully automatic dicing saws
3000 Series, 300 Series, and 500 Series automatic dicing saws

Specifications

	Standard Type (Kerf width less than 0.060 mm)

Products that include a special specification may be denoted with "ZHT-****"

Standard concentrations

Standard sizes^*3

Please contact a DISCO representative for details

	Actual blade thickness with greater than 0.060 mm

	*4	All slit widths are 0.5 mm (except for the SS type) All slit depths are 80 - 100% of exposure (except for the SS type) Blade thickness greater than 0.06 mm are available
	*5	Blade thickness greater than 0.1 mm are available
	*6	Since the applicable ranges differ depending on the grit (mesh) size, bond and concentration, please contact your DISCO representative for details.