Product Information

The NBC-ZH series provides high productivity and excellent process results thanks to its superb cutting ability and long life.

	The NBC-ZH series is produced using DISCO's original technology. A combination of an ultra-thin diamond blade and an aluminum hub provides enhanced operation efficiency and stable cutting results. In combination with DISCO's vast application knowledge, these blades provide excellent cutting results when dicing silicon wafers and compound semiconductor wafers such as GaAs.
	Hub blade handling safety sheet

Features

Advanced dicing processes - bevel and step cutting
Wide range of grit sizes and bond types to support various application requirements
Easy to handling ultra-thin blades
Short blade change time - increased productivity
Polypropylene package - environmentally friendly

Applicable Workpieces

Silicon, GaAS, GaP, LiTaO3, etc.

Applicable Machines

6000 Series and 600 Series fully automatic dicing saws
3000 Series, 300 Series, and 500 Series automatic dicing saws

Specifications

	Standard Type(Kerf width less than 0.060 mm)

^*1Standard spacification range by grit size

Standard blade types^*2

Please contact a DISCO representative for details

	Actual blade thickness with greater than 0.060 mm

	*3	All slit widths are 0.5 mm (except for the SS type) All slit depths are 80 - 100% of exposure (except for the SS type) Blade thickness greater than 0.06 mm are available
	*4	Blade thickness greater than 0.1 mm are available