DISCO Corporation, a semiconductor manufacturing equipment manufacturer (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya), has developed DFD6342, a fully automatic dicing saw that supports φ8-inch wafers, and this equipment is currently available for purchase. DFD6342 is the newer model of DFD6341, and it covers both the cutting and grooving processes for a wide range of materials used for semiconductor wafers, semiconductor packaging, and electronic components.
This fully automatic dicing saw supports Φ8-inch wafers that are widely used in the mass production of several materials and devices. For example, it is used in wafer dicing for logic ICs, discrete devices, power devices, and compound semiconductors, for package dicing, and for cutting and grooving electronic components, optical parts, and multiple types of sensors.
DFD6342 is the successor equipment to DFD6341, and has been developed aimed at energy saving and improved productivity and usability. DFD6342 supports diversified processing needs with its expandability that can flexibly adapt to user-specified specifications.
The distance between the blades mounted opposite to one another has been shortened to 19.8 mm and the number of cut lines has been increased at the same time. In addition, by reducing the return time of the processing axis and setup time using the new NCS (non-contact setup)*1, UPH*2 has increased by 6.4%. By installing an ABC (Automatic Blade Changer)*3, blade replacement operation is automated and downtime is reduced, resulting in less operator necessity and improved operating ratio.
By reducing heat generation through the adoption of a high-efficiency spindle motor, the cooling water amount has been reduced by 63%. In addition, by optimizing the air flow rate, air usage has been reduced by 20%.
A 19-inch touch panel (15-inch in the predecessor equipment) has been installed. Enlarged operation buttons and a layout with shortcuts to frequently-used screens make it easy to understand and contributes to quick operation. In addition, log data can be displayed as a graph, making it possible for operators to intuitively understand the error frequency and blade condition.
*1 Optional function
*2 Step cut die size: 2x2 mm, cut speed 50 mm/s
*3 Optional function
DFD6342 is currently available for purchase. Please contact a DISCO sales representative for more details.
About DISCO Corporation
DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) used for manufacturing semiconductors and electrical components. In addition to these products, as a result of pursuing optimal processing results for customers through the provision of the technology used in the equipment and tools, DISCO products and processing technologies have been widely adopted by device manufacturers and semiconductor subcontractors domestically and internationally. For details, please view the DISCO website www.disco.co.jp.