Applications: Silicon wafer, etc
UltraPoligrind employs an ultra-fine diamond abrasive to create higher die strength and enable grinding with even less damage than Poligrind. This new finish grinding wheel is also able to maintain a gettering effect, which is often removed when a stress relief process is used. It is a chemical-free normal grinding process resulting in a low environmental impact, and allows wafer thinning with an easy to operate process.
The damaged layer of a wafer ground using UltraPoligrind is extremely small compared to that of a wafer ground using a #2000 grinding wheel.
The amount of precipitated Cu detected on the polished surface of a mirror wafer exceeds 1.0 E11 after a copper solution was applied to the surface. In contrast, the amount of precipitated Cu detected on the backside of a wafer polished with Gettering DP is below the detection limit, thus indicating that the surface had a gettering effect.
To quantitatively measure the gettering effects, samples were contaminated with a Cu solution. The Cu was diffused at 350°C for 3 hours and then analyzed using TXRF (Total-Reflection X-ray Fluorescence). The observed Cu on the surface of the respective wafers is as seen below.
※ Detectable range at below 0.5E10 atoms/cm2
Assistance with Using UltraPoligrind
To achieve the best processing results possible with UltraPoligrind, correct formulation of the application is required. DISCO’s applications engineers will be happy to work with your workpiece and specifications to achieve the desired processing results.
Please contact a DISCO representative with your product needs such as type, wheel size, and quantity.
When you place the first order with us, please explain application information such as materials to grind, sizes, machine, type, and other specification.
We are ready to help you to determine which is our most appropriate product type for your application.
* Due to improvements in our products, it is possible that product specifications may be changed without advanced notice.
Please confirm the product specifications with a DISCO representative.
To use these DISCO blades and wheels (hereafter precision tooling) safely
Please read carefully and follow the instructions below to prevent any accidents or injuries.