Because spiral processing occurs in a certain direction, highly effective separation at high speed is possible without excessive acceleration and deceleration times for the processing axes.
Energy peak fluctuation within the laser irradiation area is low, and stable processing with high yield can be achieved for many extremely small die including micro LEDs.
|Processing method||-||Laser Lift-Off|
|Max. workpiece size||mm||Φ150|
|Moving speed||mm/s||1 ～ 1,000|
|Machine dimensions (W x D x H)||mm||2,000 × 1,810 × 1,800|
|Machine weight||kg||Approx. 3,300|
*Product appearance, features, specifications, and other details may change due to technical
*Please read the standard specification sheet thoroughly before use.