The DFM2800 is a specialized wafer mounter for inclusion in an inline system with a backgrinder to process Φ300 mm ultra-thin wafers. It mounts wafers that have been thinned with the DGP8761 system onto dicing tape or tape frames and removes the front side protection tape in a stable process. It also supports the attachment of DAF with integrated dicing tape, which is necessary for next generation SiP (System in Package) manufacturing.
To support the thinning requirements of Φ300 mm wafers less than 25 μm thick, the breakage risk of ultra-thin wafers is minimized by reducing the number of wafer handling steps to only twenty percent that of the existing model. In addition, a cleaning mechanism has been installed at each handling pad/table to prevent wafer breakage caused by particle intrusion.
By optimizing each transfer section, an approximate 50% increase* is realized in the maximum throughput for continuous operation. This greatly contributes to an improvement in productivity. (Compared to the DFM2700)
*The actual throughput depends on the wafer mount process time and surface protection tape peeling time.
While the equipment operation method is inherited from the DFM2700, the screen size is larger with better visibility to for a user-friendly and easy to understand operational environment. Furthermore, in an in-line system with a DGP8761, the DFM2800 is even easier to use because of unified management, which makes recipe selection and start/stop on the DFM2800 possible from the DGP8761.
|Wafer Diameter||mm||Φ200 / Φ300|
|Wafer attachment precision and X/Y direction (frame mount)||mm||±0.5 or less|
|Wafer attachment precision and θ direction (frame mount)||deg||±0.5 or less|
|Dicing tape attachment precision and X/Y direction||mm||±1.0 or less|
|Machine dimensions(W×D×H)||mm||2,150 × 2,643 × 1,800|
*Product appearance, features, specifications, and other details may change due to technical
*Please read the standard specification sheet thoroughly before use.