We believe that what our customers really want is not just the products that DISCO supplies but the
processing results derived from using our products as a means to an end. Based on this idea, we provide
the processing know-how (application technology) related to Kiru (cutting), Kezuru (grinding) and Migaku
(polishing) accumulated over a long period of time as the best processing results through free-of-charge
processing tests (test cuts).
The test cut support reinforces the trusting relationships with our customers and at the same time brings out further advanced expertise to draw on, including the process leading to these results. Such accumulation of know-how is what sustains our response toward highly-advance inquires from our customers.
The DISCO Head Office Applications R&D Laboratory, respected throughout the industry, features 35 machines, over 3,000 different diamond products, and 50 highly skilled applications engineers. This large and central lab handles test requests from around the world, while local facilities in Japan (Sendai, Osaka, and Kumamoto) and the US, Germany, Singapore, and China let customers participate in research at locations convenient to them.
Customers use DISCO's applications facilities in a variety of ways. Some ship their wafers or other workpieces, letting DISCO investigate and select the optimum machines, abrasive tools, and processing conditions for the job. Many customers, however, take advantage of DISCO's open doors and visit the labs themselves, working closely with DISCO's engineers to create new processes and solutions.
In fact, many manufacturers consult DISCO Applications R&D at the design stage of a new product. DISCO's engineers are eager to participate in such research, as DISCO seeks always to be the first point of contact for any Kiru, Kezuru, Migaku need.
This introduces the equipment that will be used for test cuts at the Applications Labs of DISCO worldwide affiliate offices. It is also possible to do test cuts with machines that are not shown here. And at the DISCO Corporation (Tokyo), DISCO HI-TEC AMERICA (California), DISCO HI-TEC EUROPE (Munich), DISCO HI-TEC CHINA(Shanghai), and DISCO HI-TEC SINGAPORE (Singapore), test cuts with some equipment can be conducted in a clean room. For details, please contact your DISCO sales representative.
Machine Models Used in Applications Support
|Laser Saws||DFL7160, DFL7161, DFL7360, DFL7361, DFL7362|
|Dicing Saws||DAD323, DAD3241, DAD3350, DAD3360, DAD3431, DAD3650, DFD6240, DFD6340, DFD6341, DFD6361, DFD6362, DFD6560|
|Grinders||DAG810, DFG8540, DFG8640, DFG8830|
|Polishers||DFP8140, DGP8761, DMG8762|
|Related Equipment||For details, please contact your DISCO sales representative.|
|Dicing Saws||DAD3220, DFD6362, DAD3350, DFD6340|
|Related Equipment||DCS1410, DWR1720|
|Laser Saws||DFL7160 (Fullcut/Grooving)|
|Dicing Saws||DFD6340, DFD6361 (Half Cut/Full Cut)|
|Grinders||DAG810 (TAIKO and Package Grinding)|
|Polishers||DGP8761 CMP, DGP8761+DFM2800|
|Related Equipment||Co2 Bubbler, StayClean & StayClean injector, Backgrind waste water treatment plant for ISO14000., SEM|
|Laser Saws||DFL7340, DAL7020|
|Dicing Saws||DFD6362, DAD3350, DAD322|
|Related Equipment||Laminator (12 inch), UV Irradiator, DWR1720x 2, Co2 Bubbler, StayClean & StayClean injector|
|Dicing Saws||DFD6361, DFD6560, DAD3650|
|Related Equipment||DCS1460, BG Tape Laminator, RAD3510 (8, 12in), UV irradiator (Max 12in), DWR1721, CC filter unit|
Dicing-Grinding Service at DISCO HI-TEC EUROPE GmbH:https://www.dicing-grinding.com.
|Laser Saws||DFL7160, DFL7340, DFL7341, DFL7340FH, DKL7440, DFL7262|
|Dicing Saws||DAD3220, DAD3221, DAD3350, DAD3360, DAD3650, DFD6340, DFD6341, DFD6361, DFD6560, DFD6363|
|Grinders/Polishers||DAG810, DFG8340, DFG8540, DFG8761 + DFG2800, DFP8140, DAS8920, DFS8910|
|Related Equipment||DDS2010, DKS2240, DWR1722, DTU1531, DCS1440, DPM2190CX, DFX2400, DIS100, KABRA!zen|
|Laser Saws||DFL7360, DFL7362|
|Dicing Saws||DAD3240, DAD3350|
A free-of-charge test cut is performed at an application lab to confirm whether achieving the customer's needs is possible.
Dicing and Grinding Service
It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at reasonable cost.