DISCO CORPORATION, a semiconductor manufacturing equipment manufacturer (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya), is pleased to announce that the cumulative shipments of its laser saws have exceeded 4,000 units as of February 2026.
In 2020, 18 years after the first laser saw was sold in 2002, cumulative shipments reached 2,000 units. Since then, the shipment pace has nearly tripled, with an additional 2,000 units shipped in just six years, bringing the total to over 4,000 units. Supported by the ongoing expansion in demand for advanced semiconductors, the range of applications for laser processing technologies continues to grow.

Background

Since the 1970s, blade dicing has been the primary method for semiconductor wafer dicing; however, in recent years, low-damage and high-precision processing has become necessary for high-performance logic and high-density memory.
Laser saws are increasingly being adopted as a complementary method to blade processing in applications such as the grooving process for protecting low-k films and the SDBG process used for ultra-thinned memory devices. Additionally, the KABRA technology, where laser is used to slice ingots, has been widely adopted in SiC wafer manufacturing; its application is expanding to next-generation materials such as GaN and diamond. Supported by rising demand in generative AI, continued capital investment is expected in high-performance memory and power semiconductor sectors, including advanced logic and HBM. DISCO will continue contributing to higher accuracy and greater efficiency in semiconductor manufacturing through its laser processing technologies.

*"Development of Three Laser Saws" released in December 2025

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About DISCO
DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) used for manufacturing semiconductors and electronic components. In addition to these products, as a result of pursuing optimal processing results for customers through the provision of the technology used with the equipment and tools, DISCO products and processing technologies have been widely adopted by device manufacturers and semiconductor subcontractors both domestically and internationally. For details, please visit the DISCO website at www.disco.co.jp.