The DISCO surface planer provides solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness.
(positive & negative)
|Composites of materials stated on the left|
Note: Actual processability varies depending on the workpiece. Please contact your DISCO sales representative for details.
The planarization process reduces Au bump height variation and stress (temperature and load) when bonding Au-Au interfaces for use in next generation SiP solutions.
|Bump height variation||1.7 µm|
|Bump surface roughness (Rz)||1.373 µm|
|Bump height variation||0.5 µm|
|Bump surface roughness (Rz)||0.039 µm|
Variations in resin thickness of the LED emission unit is the cause of color irregularities. Planarization of the resin and bumps with high accuracy using a diamond bit can contribute towards the stabilization of LED color emissions.
Backgrinding of wafers with large bumps can result in high wafer thickness variation. The final wafer surface thickness variation can be reduced by tape planarization prior to grinding.
|Workpiece size||-||Φ300 mm|
|Number of spindles||-||2|
|Number of chuck tables||-||2|
|Process precision||TTV||µm||Less than 3.0|
|5 x 5 mm die bump height variation||µm||Less than 1.0|
|surface roughness||µm||Within Ra 0.02|
|Machine dimensions (W × D × H)||mm||1,400 x 3,312 x 1,870|
*Product appearance, features, specifications, and other details may change due to technical
*Please read the standard specification sheet thoroughly before use.