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Cutting and Planarization Using a Surface Planer

Solutions

Surface planners use bit grinding with a diamond bit to realize high-accuracy planarization for ductile materials (Au, Cu, and solder), resin (photoresist, polyimide), and composites of these materials.

Advantages of the surface planer

  • Achieves high-precision cutting and planarization using a diamond bit
  • Because cutting is used, high-quality processing is possible even for composite materials such as resins and metals
  • Increases productivity and reduces costs by partially replacing CMP processes

Examples of surface planer processing

Cutting metal plated bumps(LCD driver IC)

By cutting bumps, the surface planer eliminates bump dents and shoulder overhangs, and solves the issues of bump height variation and surface roughness.This increases the ACF(Anisotropic Conductive Film) effective capture area on the bump surface.

Batch cutting of copper pillars and resin(pillar exposure)

The surface planer cuts resin in which copper pillars are embedded and exposes the pillars.The planarization of the top surfaces of these pillars increases the reliability of connection with other devices.We are also studying a connection method in which the planarization and exposure of solder bumps are performed for each resin piece.

  • Before cutting

    Before cutting
  • After cutting

    After cutting

Replacing CMP processes

Usually, CMP is used for planarization when batch planarization is performed for copper wiring formed on wafers and insulating film, and a wiring layer is then placed on top.Using the surface planer in this process achieves a throughput that is even better than CMP. Also, because slurry is not used, wastewater processing costs and environmental burdens are reduced.

Examples of other processes

Checking solder bump quality

In defect inspections for solder bumps, the existence of voids is usually judged from an X-ray image of the bumps.When the surface planer is used, the bump is directly cut, so the actual void condition inside the solder bumps can be checked.

  • Before cutting

    Before cutting
  • After cutting

    After cutting

Improving the plating(gold, copper)

When performing electroplating, such as for electrodes, irregularities can occur on the plating and result in a bumpy and uneven surface.By cutting this plated surface with the surface planer, an even and planarized surface can be achieved.

  • Before cutting

    Before cutting Before cutting
  • After cutting

    After cutting After cutting

Related Information

List of Surface Planers
https://www.disco.co.jp/eg/products/index.html?id=planarization


Contact

Please feel free to contact us with any questions or inquiries.

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