Surface planners use bit grinding with a diamond bit to realize high-accuracy planarization for ductile materials (Au, Cu, and solder), resin (photoresist, polyimide), and composites of these materials.
By cutting bumps, the surface planer eliminates bump dents and shoulder overhangs, and solves the issues of bump height variation and surface roughness.This increases the ACF(Anisotropic Conductive Film) effective capture area on the bump surface.
The surface planer cuts resin in which copper pillars are embedded and exposes the pillars.The planarization of the top surfaces of these pillars increases the reliability of connection with other devices.We are also studying a connection method in which the planarization and exposure of solder bumps are performed for each resin piece.
Usually, CMP is used for planarization when batch planarization is performed for copper wiring formed on wafers and insulating film, and a wiring layer is then placed on top.Using the surface planer in this process achieves a throughput that is even better than CMP. Also, because slurry is not used, wastewater processing costs and environmental burdens are reduced.
In defect inspections for solder bumps, the existence of voids is usually judged from an X-ray image of the bumps.When the surface planer is used, the bump is directly cut, so the actual void condition inside the solder bumps can be checked.
When performing electroplating, such as for electrodes, irregularities can occur on the plating and result in a bumpy and uneven surface.By cutting this plated surface with the surface planer, an even and planarized surface can be achieved.
List of Surface Planers
A free-of-charge test cut is performed at an application lab to confirm whether achieving the customer's needs is possible.
Dicing and Grinding Service
It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at reasonable cost.