Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), Various types of semiconductor packages, etc
The ultra-thin, high performance NBC-Z Series blades are a result of DISCO's original blade development. These blades employ electroformed bonds that realize superb cutting quality and blade life. In addition to dicing semiconductor wafers, these blades are suitable for dicing a wide variety of semiconductor packages.
The structural strength of the blade allows for ultra-thin blades to be realized. They are suitable for dicing and deep grooving of narrow streets.
By changing the lateral face of the blades, surface chipping and slanted cuts are minimized. This results in improved cutting quality.
Please contact a DISCO representative with your product needs such as type, wheel size, and quantity.
When you place the first order with us, please explain application information such as materials to grind, sizes, machine, type, and other specification.
We are ready to help you to determine which is our most appropriate product type for your application.
* Due to improvements in our products, it is possible that product specifications may be changed without advanced notice.
Please confirm the product specifications with a DISCO representative.
To use these DISCO blades and wheels (hereafter precision tooling) safely
Please read carefully and follow the instructions below to prevent any accidents or injuries.