With the integration of devices, wafer manufacturing processing, which requires high- planarity, is adopting surface grinding. DFG8340, the successor of DFG830 (equipment used all across the world), is equipped with a high-rigidity spindle, realizing stable and high planarization of wafers by minimizing the impact of the processing heat.
DFG8340 is a simple and compact fully automatic grinder which adopts a single spindle, dual chuck table, and single turn table structure. It can process silicon wafers less than 8- inches with low-damage low-amount processing, and SiC, sapphire, and ceramics.
General lapping is a batch process that uses loose grain, making it difficult to control the finish thickness. DFG8340 improves processing quality and the environmental load by measuring wafer thickness in real time and processing with only DI water.
Installation of a touch screen and GUI (Graphical User Interface) provides improved operability. In addition, processing and equipment status are displayed on-screen and each operation can be performed just by touching the icons. Thus, high operability during processing and maintenance is achieved.
Using the one-touch wafer shape adjustment function on the operation panel to suit the workpiece, DFG8340 achieves stable processing accuracy for a variety of workpieces.
|Supported workpiece size||-||Φ4, 5, 6, 8 inch|
|Grinding Method||-||Anomalous In-feed grinding with wafer rotation|
|Grinding Wheels||-||Φ200 mm Diamond Wheel|
|Spindle||Rated output||kW||4.2||Rotation speed range||min‐1||1,000 ～ 7,000|
|Equipment dimensions (W × D × H)||mm||800 × 2,450 × 1,800|
*Product appearance, features, specifications, and other details may change due to technical
*Please read the standard specification sheet thoroughly before use.
|Machine dimentions（W × D × H）|
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