The DAG810 is a compact, automatic grinder for workpieces up to 8" in diameter. It has one spindle and one chuck table and is designed to process a variety of materials.
Machine dimensions: 600 (W) x 1,700 (D) x 1,780 (H) mm
Adoption of high-rigidity, low-vibration spindle provides superior grinding results and is capable of in-feed grinding and creep feed grinding (user-specified specification).
Process hard or brittle substrates of various diameters with ease. The DAG810 is also the choice for processing a wide variety of electronic components.
Installation of a touch screen and GUI (Graphical User Interface) provides improved operability. In addition, processing and equipment status are displayed on-screen and each operation can be performed just by touching the icons.
|Wafer Diameter||-||Φ8 inch
(Φ4, 5, 6, 8 inch with universal chuck table use)
|Grinding Method||-||Anomalous In-feed grinding with wafer rotation|
|Grinding Wheels||-||Φ200 mm Diamond Wheel|
|Revolution speed range||min‐1||1,000 ～ 7,000|
|Machine dimensions (W × D × H)||mm||600 × 1,700 × 1,780|
*Product appearance, features, specifications, and other details may change due to technical
*Please read the standard specification sheet thoroughly before use.
|Machine dimentions（W × D × H）|