Provides fully automated transport, grinding, and spinner cleaning for square workpieces of up to 390 x 390 mm, including medium-sized 300 x 300 mm PLP substrates.
Enhanced handling capabilities, including transfer and vacuum chucking of warped package substrates, together with features such as end-point detection using an NCG (non-contact gauge)* and in-process grinding wheel cleaning*, enable the unit to meet the advanced processing requirements of advanced packaging.
* Available as a user-specified specification
Grinding of workpieces mounted on a tape frame is supported. This enables processing of warped workpieces, simultaneous grinding of multiple workpieces, and processing of various workpiece sizes without the need for size conversion.
| Equipment type |
| Spindle |
| C/T |
| Dimensions(W × D × H) |
| Weight(kg) |
Please feel free to contact us with any questions or inquiries.