Provides fully automated transport, grinding, and spinner cleaning for square workpieces of up to 390 x 390 mm, including medium-sized 300 x 300 mm PLP substrates.
Enhanced handling capabilities, including transfer and vacuum chucking of warped package substrates, together with features such as end-point detection using an NCG (non-contact gauge)* and in-process grinding wheel cleaning*, enable the unit to meet the advanced processing requirements of advanced packaging.
* Available as a user-specified specification
Grinding of workpieces mounted on a tape frame is supported. This enables processing of warped workpieces, simultaneous grinding of multiple workpieces, and processing of various workpiece sizes without the need for size conversion.
By changing the workflow, the unit supports parallel grinding, in which both processing spindles grind simultaneously, in addition to conventional rough grinding followed by fine grinding.
| Machine type |
| Spindle |
| C/T |
| Machine dimentions(W × D × H) |
| Machine weight(kg) |
Please feel free to contact us with any questions or inquiries.