Application processing examples
Demand is growing for ultra-thin LCD driver die packages, which are used to power and control LCD screens on mobile phones and computers, to realize compact highly functional devices. These advances have led to a growing demand for high-strength die.
The following graph outlines test results for die strength and drop strength for die processed using
conventional grinding method and DBG.
Die processed using the DBG process showed less backside chipping compared to conventional grinding processes, displaying superior die strength and drop strength.
Photo 1:Conventional grinding processing results
Photo 2:DBG processing results
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A free-of-charge test cut is performed at an application lab to confirm whether achieving the customer's needs is possible.
Dicing and Grinding Service
It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at reasonable cost.