Application processing examples
This is to introduce a processing method for gallium arsenide which easily generates chipping.
The dicing of gallium arsenic (GaAs) has the following general tendencies.
The confirmation method for the influence crystal orientation and general blade specification and conditions for processing GaAs are introduced below.
Using a standard blade (Please refer to the item on the blade specification) the influence of the crystal
orientation is confirmed according to the following procedures.
However, when the crystal orientation is shifted by 45º and there is a pattern, the chipping becomes the same level for either channel.
|Mesh size||#4000 to #5000|
|Example of blade type||ZH05 SD4800-N1-70 BB|
|Feed speed||1 to 10 mm/s|
|Spindle rotation||20000 to 30000 rpm|
|Cut depth||The shallower the cut depth into the tape, the more backside chipping quality improves.|
Chipping size differs in the CH 1 and CH 2 processed lines according to the difference of crystal orientation.
A free-of-charge test cut is performed at an application lab to confirm whether achieving the customer's needs is possible.
Dicing and Grinding Service
It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at reasonable cost.