A high-torque spindle that supports large diameter blades and difficult-to-process materials.

Ultrasonic-assisted dicing with a blade vibration method that improves processing performance for difficult-to-process materials such as glass and ceramics.

A mechanism that detects the blade tip position through setup using a transmissive sensor. Prevents damage to the blade edge and improves processing quality. With the latest model of NCS, measurement time is reduced and UPH improves. (NCS: Non-Contact Setup)

An automation mechanism for blade replacement. Eliminates downtime while waiting for an operator and operation errors, thereby improving equipment operability. Record management is possible by automatically recording the wafers and the blade used.

A specification for an additional sub-C/T. Enables interval dressing during workpiece processing.

A specification in which the PRECUTBOARD® is mounted on the tape frame and loaded from the frame cassette. The precutting process can be automated with this specification.

A specification in which the PRECUTBOARD® is mounted on the tape frame and loaded from the inspection stage. The precutting process can be automated with this specification.

A function to scan the 2D barcode on the PRECUTBOARD® on the sub-C/T and cross-check with the device data to prevent precutting errors.

A mechanism in which a laser sensor tracks various types of measured surfaces such as based on the workpiece top surface, based on the backside due to Si transmission, and based on the top side of the surface layer. Enables highly-accurate cut depth control.

A mechanism in which cut depth is controlled based on the workpiece top surface that is measured using a back pressure sensor.

A mechanism that measures the height of workpieces for which contact with a touch sensor is possible, such as package substrates. Enables cut depth control in accordance with the height of measured points.

A function to automatically perform warm-up before processing when the equipment has been stopped for a longer period than the set period in order to make the processing accuracy stable.

One-touch blade replacement specification. Reduces blade replacement time and prevents operation errors. (for hub blades)

One-touch blade replacement specification. Reduces blade replacement time and prevents operation errors. (for hubless blades)

A set of jigs including a torque driver for nutless flanges.

A mechanism in which the slits of the blade cooler nozzle are enlarged in order to increase the amount of cooling water. Effective for workpieces with a large processing load.

A specification with a 3 o'clock nozzle and spray duct. Prevents particles from spreading on the workpiece surface.

A specification with a V nozzle and spray duct. Prevents particles from spreading to the die by enclosing the wheel with the wheel cover.

A specification that improves cutting water supply to the processing point with enlarged slits in the cooler nozzle and deep-cut nozzle. Effective for workpieces with a large processing load.

A wheel cover with a cutting section atomizing nozzle specification that improves cleaning performance. Can be used with hub blades. (BBA: Blade cooler with Built-in Atomizing nozzle)

Performs forced exhaust with a wheel cover that is directly connected to the duct. Efficiently discharges mist and particles that are generated around the processing point.

A function to remove foreign objects on the C/T after cutting using C/T blow and air curtain.

A UV irradiation unit for UV curing-type dicing tapes. Achieves uniform irradiation, accurate light intensity control, and energy saving.

A specification that supports a process to semi-cure the UV tape adhesive before cutting with a UV irradiation unit. Effective in reducing backside chipping and adhesive residue during cutting.

A specification that skips cutting and only performs UV irradiation.

C/T and spinner table that support square workpieces (253 × 253 mm) such as package substrates.

A function that sets the contact setup position when a square table is used.

A tape frame that supports square tables (253 × 253 mm). (DTFS250-01)

A specification with an IR microscope. Enables transmissive alignment for workpieces such as bonded wafers.

A specification that adds a micro microscope on the Z2-axis. Increases the speed of kerf check during dual cut and improves UPH.

Enables selection of an optimal microscope magnification for observing the workpiece surface. Standard magnification is approx. 300x. Applied to both axes when the micro microscope for the Z2-axis is selected.

A function that recognizes the workpiece shape with a camera. Improves UPH by reducing alignment errors and applying cut strokes in accordance with the workpiece shape when cutting wafer pieces.

A mechanism that provides continuous water supply to the entire workpiece surface during processing. Prevents the workpiece surface from drying out and suppresses contamination.

A specification with a flow checker instead of a flow rate controller. Effective when cutting liquid is used or when the flow rate needs to be visually checked.

A specification with a stainless cover on the X-axis bellows. Prevents breakage of bellows due to remnants from QFN substrates.

A built-in type duct fan that improves mist discharge performance when the duct air flow is small.

A mechanism that uses ions to neutralize static electricity and reduce electrostatic charge. It effectively suppresses static charge buildup on the workpiece and reduces the risk of electrostatic damage.

A unit that adjusts resistivity by dissolving carbon dioxide in DI water. Reduces electrostatic charging and particle adhesion on workpieces.

A unit with an ionizer and antistatic spinner table. Suppresses separation charge.

A specification in which inline filters are inserted in clean air piping for devices such as image sensors.

A spinner nozzle that discharges a mixed fluid of DI water and clean air onto the workpiece. Improves cleaning performance.

A spinner nozzle that discharges a mixed fluid of DI water and clean air onto the workpiece. This is a highly clean type and higher cleaning performance than the S-type atomizing nozzle is expected.

A monitoring function with a flow rate sensor added to the spinner atomizing cleaning mechanism. Enables flow rate monitoring both for water and air.

A piping specification for secondary cleaning liquid usage during spinner cleaning.

A dressing function to correct the blade tip to a flat shape by moving the axis in the Y direction. This operation should be performed manually.

A dressing function to correct the blade tip to a flat shape by moving the axis in the Y direction. Flat dressing can be performed even during processing by using a sub-C/T for the dresser board.

A dressing function to correct the blade tip to a flat shape by moving the axis in the Y direction. Flat dressing is automatically performed with the dresser board mounted on the tape frame and set to the dedicated slot.

A function to decide the cutting position by performing alignment with multiple cutting lines in accordance with the settings. Effective for workpieces with warpage such as package substrates.

A function to decide the cutting position by performing alignment with multiple cutting lines in accordance with the settings. Effective for round-shaped workpieces with distortion.

Performs alignment based on the symmetry of the image in the vertical direction across the street, and the center line becomes the cut line. Effective for wafers with different street widths.

A function to perform alignment based on the detected workpiece edge and determine the cut line. Effective for wafers without patterns.

A function to detect workpiece position deviation from the C/T center. Enables cut position adjustment during edge-stop cut or edge trimming.

A function to perform alignment using two targets. Effective for workpieces such as package products with different targets on the right and left sides.

A function that performs image recognition based on the outline of the alignment target. Effective when contrast is low or adhered particles are present on the workpiece during observation using a microscope.

A function that recognizes the target on the workpiece front side again after standard alignment and adjusts the cut position. Effective when cutting line position deviation occurs between the workpiece center and edge due to issues such as workpiece distortion.

A function to recognize die layout and adjust the θ position within the range of ± 45 degrees. Effective when there is a large workpiece mounting variation in the θ direction in relation to the tape frame.

A processing method to perform a chopper and traverse cut on the workpiece without cutting all the way through.

Processing in which the θ-axis is rotated and a height difference is formed on the wafer edge. Effective in reducing edge cracking during wafer thinning.

Processing in which the θ-axis is rotated and wafers are cut out in a circle shape. Effective in creating wafers for verification.

A setting for not cutting the wafer edge so that the wafer is not completely cut. Prevents scattering of triangular die on the wafer edge.

A function to adjust feed speed around the start and end of the cutting line. Prevents meandering due to the arc of the wafer edge.

A function to unify the cut progression directions of all axes during dual cut. Equalizes the effects of chipping.

Cut sequence that prevents the blade from coming into contact with the tape frame when the tape frame is not pulled down during cutting. Used when tension should not be applied to the dicing tape.

A function to check the quality of wafers cut on streets after laser grooving.

A function to compare microscope images before and after cutting and detect the area that has changed as the kerf. Effective for workpieces with kerfs that are hard to see, such as semi-transparent workpieces.

A melody is played instead of an alarm when full-auto operation is completed or the operator is being called.

Installed with a communication port to input/output data to/from external sources. Compatible with LAN and RS232C.

Installed with communication software that complies with SECS/GEM.

Installed with communication software that complies with GEM300.

Hardware for reading barcode labels on the tape frame.

Hardware for reading barcode labels on the cassette and blade case.

A function to automatically set the registered device data in accordance with the barcode information on the tape frame.

A function to automatically set the blade information upon replacement in accordance with the barcode information on the blade case.

Software that records information obtained through sensors inside the equipment and saves the data in CSV format. Communication with an external server is also possible.

A network system for connecting multiple DISCO equipment units. Contributes to improved productivity through functions such as operation monitoring, remote control, and graphed data obtained with sensors inside the equipment.

An external unit that injects StayClean (additive for cutting water) and monitors its concentration in conjunction with equipment operation.

A separate unit that maintains the temperature of cutting water and cooling water so that processing accuracy remains stable.

A built-in unit that supplies power from a battery to equipment in case of power failure or voltage drop. When power failure continues, shutdown will be safely performed.

A step-down transformer unit that is needed when equipment is used with 3-phase AC 380-415 V.

A pump-up unit that is needed when the pressure of DI water is low.

A pump to pressurize spinner cleaning water within the set pressure range.

An external cover made of stainless steel.

Protects operator from upward and downward movements of the elevator by adding a cover on the cassette stage section.

Metal fixture to secure equipment to the floor. Prevents equipment from falling over in case of disasters such as an earthquake.

A dedicated drain pan placed beneath the equipment base.

A water leakage detection unit that can be additionally installed to the drain pan. Shuts down water supply when water leakage is detected.

A filter unit suitable for cutting water, cooling water, and cleaning water.

An external unit to suction the mist discharged with the forced exhaust specification.

A set of jigs for 2-inch hub mounts that are necessary for blade installation, including a torque driver, removal jigs, and conditioning jigs.

A set of jigs for 3-inch hub mounts that are necessary for blade installation, including a torque driver, removal jigs, and conditioning jigs.

A set of jigs for R-type flanges for blade installation, including a torque driver, removal jigs, and conditioning jigs.

A set of jigs for S-type flanges for blade installation, including a torque driver, removal jigs, and conditioning jigs.

R-type flanges of different sizes.

S-type flanges of different sizes. (supports 2.2 kW spindle)

A set of jigs for hoisting equipment when moving the equipment upon installation, etc.

An air gun with a higher blow pressure than the standard.

A pen for operating the touchscreen.

A measurement instrument to check the exhaust duct capacity.

A set containing a Phillips screwdriver, flathead screwdriver, Allen wrench, and open ended wrench.

A set containing an oilstone, precision screwdriver, adjustable angle wrench, dial gauge, and grease injector.

Parts and consumables needed for maintenance and part replacement performed every 365 days.

A ring-shaped jig for securing workpieces using tape. This is a high-accuracy product aiming for stable operation from tape mounting to die bonding. The Φ300mm specification complies with SEMI G77.

A cassette used for storing wafers mounted on tape frames. This is a high-accuracy product aiming for stable operation from tape mounting to die bonding. The Φ300mm specification complies with SEMI G77.