DFG8360Fully Automatic Grinder

High-precision grinder that can achieve superior flatness

Φ300 mm
1 axis, 2 chuck tables

In wafer manufacturing, batch-type lapping is commonly used for the planarization process. By introducing surface grinding using DFG8360, the load on the lapping process can be minimized while enabling stable, precise thickness control through single-wafer processing.

Furthermore, the use of a fine-mesh grinding wheel reduces the load on subsequent polishing processes, contributing to improved productivity through shorter processing times.

Wafer manufacturing process

Highly stable continuous processing

DFG8360 features a high-rigidity, low-vibration spindle that minimizes the impact of heat and vibration on processing accuracy, enabling highly stable continuous processing.

Wafer shape control

When performing surface grinding with DFG8360, the processing point can be precisely controlled to adjust the wafer shape as desired. As the wafer profile required in downstream processes can be designated on DFG8360, production of high-quality wafers can be achieved.

Work Flow System

Robot pick unloads the work from the cassette and transfers it to the positioning table
Work is centered on the positioning table
Transfer arm 1 picks up the work from the positioning table and backside cleaning is performed
Work is transferred to the chuck table
Grinding is performed
Transfer arm 2 picks up the work from the chuck table
Work is transferred to the spinner table
Work is cleaned and dried on the spinner table
Robot pick transfers the work from the spinner table to the cassette

Specifications

Specification		Unit
Supported workpiece size		-	Φ300 mm
Grinding method		-	In-feed grinding with wafer rotation
Grinding wheel		-	Φ300 mm diamond wheel
Spindle	Rated output	kW	7.5
	Rated torque	N・m	17.9
	Rotation speed range	min^‐1	1,000 - 4,500
Equipment dimensions（W × D × H）		mm	1,000 × 3,050 × 2,000
Equipment weight		kg	Approx. 4,000

*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.

Product Lineup



Machine type
Spindle
C/T
Machine dimentions（W × D × H）
Machine weight（kg）


DAG810	DAG811	DFG8340	DFG8540	DFG8541	DFG8560	DFG8640	DFG8830	DFG8020	DGP8761	DGP8762
Automatic	Automatic	Fully Automatic	Fully Automatic	Fully Automatic	Fully Automatic	Fully Automatic	Fully Automatic	Fully Automatic	Fully Automatic	Fully Automatic
1	1	1	2	2	2	2	4		3	3
1	1	2	3	3	3	3	5		4	4
600 × 1700 × 1780	600 × 1500 × 1800	800 × 2450 × 1800	1200 × 2670 × 1800	1100 × 2800 × 1800	1400 × 3190 × 1800	1000 × 2800 × 1800	1400 × 2500 × 2000		1690 × 3315 × 1800	1690 × 3451 × 1800
1300	1600	2500	3100	3000	4000	3500	6000		6700	6850