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6-inch GaAs Wafer Thinning when it is Secured with Tape

Application processing examples

The advantages of processing GaAS wafers on tape was previously introduced in "GaAs Wafer Thinning with Tape Securing Process". This article will present examples of ø6-inch GaAs wafer thinning on tape.

Processing Example

A 90 µm finish could be realized without any problem when a 6-inch GaAs wafer was processed after being secured with tape. Its handling did not produce any problem. The wheels used were #600 and #4800 for rough and finish grinding respectively.

Surface roughness (after finish grinding)

Surface roughness


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