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Corporate Outline

High-Quality Grinding of Lithium Tantalate

Application processing examples

Processing Example

Higher quality processing is now possible for 4-inch LT wafers used in SAW device substrates and other components.

Surface Roughness Data

The surface roughness values are approximately Ra: 0.002 µm, and Ry: 0.017 µm.

Surface After Processing

  • Conventional processed surface

    Conventional processed surface
  • High-quality processed surface

    High-quality processed surface


Please feel free to contact us with any questions or inquiries.