Application processing examples
Typically, GaAs wafers are secured with wax, but based on the application, tape securing for grinding is also possible.
GaAs is an easily damaged material, so typically wax securing is chosen for grinding due to its strong retaining force. However, if the wheel, processing conditions, tape, and other variables are chosen properly, tape secured grinding is also possible.
A free-of-charge test cut is performed at an application lab to confirm whether achieving the customer's needs is possible.
Dicing and Grinding Service
It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at reasonable cost.